name: ic_bga

entries:
    - code: PKG
      example: BGA
      title: Package name
    - code: Pincount
      title: Number of (unique) pins
      delimiter: "-"
      example: 24
    - code: X
      example: 3.2
      title: Major dimension of part on x axis
    - code: "Y"
      example: 4.4mm
      title: Major dimension of part on y axis
      delimiter: x
    - code: Z
      title: Major dimension of part on z axis
      delimiter: x
      optional: 1
    - code: Columns
      title: Number of ball columns
      example: 3
      prefix: Layout
    - code: Rows
      title: Number of ball rows
      delimiter: x
      example: 4
    - code: Pitch X
      prefix: P
      example: 0.5mm
      title: Ball pitch in x direction
    - code: Pitch Y
      delimiter: x
      optional: 1
      title: Ball pitch in y direction (if different from x direction
    - code: Ball
      prefix: Ball
      title: Ball diameter
      example: 0.25mm
    - code: Pad
      prefix: Pad
      example: 0.2mm
      title: Pad diameter
    - code: NSMD/SMD
      example: NSMD
      title: Solder Mask Defined or Non Solder Mask Defined
    - code: Modifiers
      title: Footprint modifiers
      optional: 1
    - code: Options
      title: Extra footprint options
      optional: 1
